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MATERIALS CENTER
MATERIALS CENTER

Materials

NATERIAL

CORESIC® SPG

CORESIC® SPG Pressureless sintered silicon carbide (SSiC) with graphite, formd by CIP or Dry press

 

 

Material Characteristics

The use of ultrafine silicon carbide micropowder (particle size is usually in 0.5-1.0μm) as raw materials, and within 15% of the graphite material for the composite, through the spray drying process to form the granulation powder, through the dry pressure or isostatic pressure and other processes to form the green body, vacuum or argon protection under high temperature sintering (temperature is usually in the 2100-2200 ℃), the density of generally 2.5g-3/cm3, the grain size is generally not More than 20μm.

 

 

Features and Applications

CORESIC® SPG Silicon Carbide material is a high thermal conductivity silicon carbide ceramic material developed specifically for the glass molding field (hyperlink). It maintains many of the excellent properties of CORESIC® SP Silicon Carbide material while making the processing of silicon carbide ceramics much easier, thus making the manufacture of large-volume silicon carbide molds possible.

 

 

Material Performance Table