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MATERIALS CENTER
MATERIALS CENTER

Materials

NATERIAL

SSIC

Material Characteristics

The use of ultrafine silicon carbide micropowder (particle size usually in 0.5-1.0μm) as raw materials, adding certain sintering additives, such as solid-phase system is generally used in B4C-C, the liquid-phase system is generally used in Al2O3-Y2O3, usually need to add binder, dispersing agent, and other organic solvents, the formation of granulated powder through spray drying process, the use of a variety of molding processes, high temperature sintering in vacuum or under argon gas protection ( Temperature is usually 2100-2200 ℃), the sintered density is usually greater than 98% of the theoretical density, the density is generally 3.10-3.18g/cm3, grain size is generally not more than 20μm.

 

 

Performance Characteristics

  • Super hardness, excellent wear resistance (typically Vickers hardness over 2000 GPa)
  • Very high bending strength (usually three-point bending strength greater than 350 MPa)
  • High temperature resistance (typical use temperature over 1500°C)
  • High thermal conductivity (room temperature thermal conductivity typically greater than 120 W/m/K) and low coefficient of thermal expansion (room temperature CTE typically less than 2.5 ppm/°C)Comprehensive chemical and ion etching resistance (non-pressurized solid phase systems are resistant to strong or complex acids, including hydrofluoric acid, for long periods of time)
  • Enables the manufacture of large-sized and complex structural components