CORESIC® SP
CORESIC® SP Pressureless sintered silicon carbide (SSiC) by CIP or Dry press
Material Characteristics
The use of ultrafine silicon carbide micropowder (particle size usually in 0.5-1.0μm) as raw materials, B4C-C for sintering additives, through the spray drying process to form a granulated powder, through the dry or isostatic pressure molding of the green body, vacuum or argon protection under high-temperature sintering (the temperature is usually in the 2100-2200 ℃), the density of generally 3.14-3.15g/cm3, grain size is generally not more than 20μm.
Features and Applications
CORESIC® SP Silicon Carbide material has very high with excellent mechanical properties, excellent high temperature stability, as well as good specific stiffness and optical processing performance, suitable for the manufacture of chemical corrosion-resistant products, ion-etching-resistant products and lightweight products and other components, used in optoelectronic lighting, semiconductors, electronic glass, aerospace and national defense and security and other fields.
Material Performance Table

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