CORESIC® RBP
CORESIC® RBP Reaction bonded silicon infiltrated silicon carbide (SiSiC), formed by CIP
Material Characteristics
Adopting silicon carbide micro-powder with different particle sizes and particle gradations as raw materials, adding different active carbon sources as the second phase, adding dispersant, binder, pressurizing agent, etc. to make high solid-phase slurry, spray granulation and drying to produce a high-fluidity spherical powder, molding or isostatic molding process, high-temperature reactive silicone seepage sintering under the protection of the vacuum atmosphere, the usual sintering temperature of 1600-1700℃, sintering density density is usually 3.0-3.05 g/cm3, free silicon content is usually 15-20%.
Features and Applications
CORESIC® RBP silicon carbide material has very high with excellent mechanical properties at room temperature and high temperature bearing capacity, good wear resistance and high thermal conductivity, excellent high temperature stability, suitable for the manufacture of high-temperature-resistant products, high thermal conductivity, abrasion, corrosion, high-temperature bearing and other components, can be applied to battery materials, electronic glass, wear-resistant structural components and other fields.
Material Performance Table

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