Silicon carbide CMP carrier
CORESIC® SP silicon carbide CMP carrier is formed by isostatic pressing and high temperature sintering. The outer diameter, thickness size, number of acupuncture points, size, position and shape of the film-taking slot can also be processed according to the requirements of the user's design drawings to meet the specific requirements of the users.
Typical application
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CMP (chemical mechanical polish) in LED chip manufacturing is a chemical mechanical polishing process.
Features and advantages
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Good thermal conductivity, low expansion coefficient and uniform temperature performance.
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Compared with the traditional corundum carrier plate, the heating and cooling time of loading and unloading is shortened, and the work efficiency is improved; at the same time, it can reduce the wear between the upper and lower plates, maintain good plane accuracy, and extend the service life by about 40%.
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The material has a small specific gravity and light weight. It is easier for operators to carry the tray, reducing the risk of collision damage due to difficult handling by about 20%.
Specification
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It can be processed according to the customer's drawing requirements, the maximum size: diameter 500mm, flatness: within 0.003mm.
