Silicon carbide robotic arm
CORESIC® SP silicon carbide robotic arm is formed by isostatic pressing and high temperature sintering. The external dimensions, thickness dimensions and shapes can be finished according to the user's design drawings to meet the user's specific requirements.
Typical application
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Used for wafer transfer in various semiconductor manufacturing processes.
Features and advantages
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With precise dimensions and thermal stability.
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High specific stiffness and excellent thermal uniformity, it is not easy to bend and deform after long-term use.
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It has a smooth surface and good abrasion resistance, so that the wafer can be handled safely without particle contamination.
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CORESIC® SP silicon carbide has a resistivity of 106-108Ω, is non-magnetic, and meets the requirements of anti-ESD specifications; it can prevent static electricity from accumulating on the surface of the wafer.
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Good thermal conductivity, low expansion coefficient.
Specification
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Arms of different shapes and sizes can be processed according to customer drawings.
