Silicon carbide heating plate
CORESIC® SP silicon carbide heating plate is formed by isostatic pressing and high temperature sintering. The heating element hole, temperature measurement, positioning hole and slotting can be processed according to the requirements of the user's design drawings.
Typical application
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Mobile phone, flat panel display 3D glass hot bending machine.
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Auto final control display 3D glass thermoforming machine.
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Aspheric glass mould pressing thermoforming machine (moulding machine).
Features and advantages
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High thermal conductivity, good temperature uniformity, fast heat transfer and heat dissipation, and fast thermal response (heating and cooling speed).
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Good oxidation resistance at high temperature.
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No deformation at high temperature, good flatness.
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Good wear resistance, no dust pollution.
Specification
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CORESIC® SP silicon carbide heating plate can be customized according to customer requirements.
