Silicon carbide mold
CORESIC® SPG silicon carbide is a high thermal conductivity silicon carbide ceramic material specially developed by Sanzer scientists for glass hot bending molds. While maintaining many excellent characteristics of CORESIC® SP silicon carbide material, it makes the processing of silicon carbide ceramics easier, thus making the rapid manufacturing of large quantities of silicon carbide molds possible.
Typical application
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Mobile phone, flat panel display 3D glass hot bending mold.
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Automotive final control 3D glass hot bending mold.
Features and advantages
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Sufficient hardness and mechanical strength, no deformation at high temperature, long die life.
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High temperature stability: avoid decomposition in the mold atmosphere or high temperature reaction with the atmosphere.
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Thermal shock resistance: withstand repeated heating - cooling cycles in the molding process.
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Demoulding property: does not react with glass.
Specification
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CORESIC® SPG silicon carbide molds can be customized according to customer requirements.
