Typical application
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In semiconductor manufacturing, a very thin wafer is placed on a silicon carbide vacuum chuck, connected to a vacuum generator, and the wafer is fixed by vacuum suction.
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Used in lithography, etching, laser processing, wafer inspection and other processes.
Features and advantages
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With precise dimensions and thermal stability.
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Good thermal conductivity, low expansion coefficient and uniform temperature performance.
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Extremely high wear resistance and surface finish, pore size is small and uniform distribution, which can uniformly adsorb each area of the wafer.
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Has excellent acid and alkali corrosion resistance.
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Resistance to plasma impact.
Specification
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Can be customized processing according to the customer's drawings.
